TE0820-05-2BE21ML

TE0820-05-2BE21ML

  • Description:MOD MPSOC 2GB DDR4
  • Series:TE0820

SKU:364bd5295717 Category: Brand:

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Product Detailed Parameters

  • Description:MOD MPSOC 2GB DDR4
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor:Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Pin(s)
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0820-05-2BE21ML

Overview

The TE0820-05-2BE21ML is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated programmable logic and processing system capabilities. The module features 2 GByte of DDR4 SDRAM for high-speed data handling. It operates within a temperature range of -40°C to +85°C, ensuring reliability in industrial environments. The physical dimensions are standardized at 4 cm x 5 cm, facilitating compact integration into carrier boards.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC architecture combining ARM processors and FPGA fabric
  • Includes 2 GByte DDR4 SDRAM for efficient memory management
  • Supports extended industrial operating temperatures from -40°C to +85°C
  • Compact 4x5 cm form factor suitable for space-constrained designs

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-performance mixed-signal processing
  • Aerospace and defense avionics systems demanding ruggedized components
  • Test and measurement equipment utilizing FPGA flexibility

Procurement Notes

Verify current availability status as this specific model may be subject to supply constraints or end-of-life notices. Confirm compatibility with existing carrier board designs regarding pinout and power requirements. Check for any Product Change Notifications (PCNs) that might affect component sourcing or long-term support. Ensure the supplier provides official documentation and traceability records for quality assurance purposes.

Selection Notes

Select this module when a combination of ARM processing power and FPGA configurability is required in a small footprint. Consider the 2GB DDR4 capacity for applications involving large data buffers or complex image processing. Evaluate the -40°C to +85°C rating against environmental conditions. Compare interface availability such as PCIe, SATA, and USB against specific I/O needs of the target application.

Part Context

This part belongs to the TE0820 series of SOMs from Trenz Electronic, which are based on Xilinx/AMD Zynq UltraScale+ MPSoC devices. These modules are designed to accelerate development cycles by providing a pre-validated hardware platform. The series typically offers various configurations differing in processor speed grade, memory size, and storage options, allowing customization for diverse performance requirements.

Replacement Considerations

Direct replacements should be sought within the same TE0820 family or other Trenz Electronic SOMs using similar Zynq UltraScale+ processors. Verify mechanical compatibility with existing carrier boards. Check if alternative modules offer equivalent or superior I/O interfaces and memory configurations. Consult manufacturer documentation for any recommended upgrades or successor parts.

TE0820-05-2BE21MLTE0820-05-2BE21ML

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