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The TE0820-05-2BE21ML is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated programmable logic and processing system capabilities. The module features 2 GByte of DDR4 SDRAM for high-speed data handling. It operates within a temperature range of -40°C to +85°C, ensuring reliability in industrial environments. The physical dimensions are standardized at 4 cm x 5 cm, facilitating compact integration into carrier boards.
Verify current availability status as this specific model may be subject to supply constraints or end-of-life notices. Confirm compatibility with existing carrier board designs regarding pinout and power requirements. Check for any Product Change Notifications (PCNs) that might affect component sourcing or long-term support. Ensure the supplier provides official documentation and traceability records for quality assurance purposes.
Select this module when a combination of ARM processing power and FPGA configurability is required in a small footprint. Consider the 2GB DDR4 capacity for applications involving large data buffers or complex image processing. Evaluate the -40°C to +85°C rating against environmental conditions. Compare interface availability such as PCIe, SATA, and USB against specific I/O needs of the target application.
This part belongs to the TE0820 series of SOMs from Trenz Electronic, which are based on Xilinx/AMD Zynq UltraScale+ MPSoC devices. These modules are designed to accelerate development cycles by providing a pre-validated hardware platform. The series typically offers various configurations differing in processor speed grade, memory size, and storage options, allowing customization for diverse performance requirements.
Direct replacements should be sought within the same TE0820 family or other Trenz Electronic SOMs using similar Zynq UltraScale+ processors. Verify mechanical compatibility with existing carrier boards. Check if alternative modules offer equivalent or superior I/O interfaces and memory configurations. Consult manufacturer documentation for any recommended upgrades or successor parts.