TE0820-05-2BE81MA

Overview

The TE0820-05-2BE81MA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated programmable logic and ARM Cortex-A53 processors. The module features 2 GByte of DDR4 SDRAM and supports industrial operating temperatures ranging from -40°C to +85°C. Physical dimensions are standardized at 4 cm x 5 cm. Connectivity interfaces include DisplayPort, GMII Ethernet, PCIe, SATA 3.1, and USB 3.0, facilitating high-speed data transfer and peripheral integration in demanding environments.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC architecture combining FPGA fabric and dual-core ARM Cortex-A53 processors
• Supports industrial temperature range operation suitable for harsh environmental conditions
• Provides multiple high-speed interface options including PCIe, SATA 3.1, and USB 3.0
• Compact 4x5 cm form factor designed for space-constrained embedded system designs

Applications

• Motor control development platforms utilizing Simulink hardware/software workflows
• Industrial automation systems requiring real-time processing and programmable logic
• Embedded computing solutions needing high-bandwidth data acquisition and transmission
• Custom embedded designs integrating FPGA acceleration with ARM processor control

Procurement Notes

Verify current supply status directly with Trenz Electronic or authorized distributors, as availability may vary. Confirm specific ordering suffixes match required performance grades and interface configurations. Request official datasheets and mechanical drawings for integration planning. Check for end-of-life notifications or discontinuance alerts prior to finalizing design-in decisions. Ensure compatibility with baseboard designs regarding power delivery and signal integrity requirements.

Selection Notes

Select this module when a compact SOM solution is required that combines programmable logic with a powerful ARM processor core. Consider the 2 GB DDR4 capacity for applications involving large data buffers or complex image processing tasks. Evaluate the available interfaces against system connectivity needs, noting support for SATA and PCIe for storage and expansion. Verify thermal management strategies align with the industrial temperature rating and expected load conditions during operation.

Part Context

This component belongs to the TE0820 series of System-on-Modules from Trenz Electronic, which focuses on AMD Xilinx Zynq UltraScale+ MPSoC technology. The series offers various memory and interface configurations within a standard 4x5 cm footprint. These modules are positioned for professional engineering applications requiring robust embedded computing capabilities, distinct from consumer-grade components. They serve as foundational building blocks for custom carrier boards in industrial and specialized sectors.

Replacement Considerations

Publicly confirmed direct substitutes are not explicitly listed in the provided documentation. Designers should evaluate other modules within the TE0820 family for pin-compatible or functionally similar alternatives with different memory sizes or interface sets. Cross-reference with Trenz Electronic's current portfolio for updated versions of Zynq UltraScale+ based SOMs. Consult manufacturer guidelines for any recommended migration paths if the specific model becomes unavailable.