TE0820-05-2BI81MA

Overview

The TE0820-05-2BI81MA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor, specifically the XCZU5EV-1SFVC784I variant, providing combined FPGA and ARM Cortex-A53 processing capabilities. The module includes 2 GByte of DDR4 SDRAM for high-speed data handling. It supports industrial operating temperatures ranging from -40°C to +85°C and features a compact 4 cm x 5 cm form factor suitable for space-constrained designs.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and programmable logic fabric
• Includes 2 GByte DDR4 SDRAM for efficient memory management
• Supports multiple high-speed interfaces including DisplayPort, PCIe, SATA 3.1, GMII, and USB 3.0
• Industrial temperature rating ensures reliable operation in harsh environments

Applications

• Industrial automation and control systems requiring real-time processing
• Medical imaging devices needing high-bandwidth data acquisition
• Automotive infotainment and instrument clusters
• Test and measurement equipment with FPGA-based signal processing

Procurement Notes

Verify current availability status as supply situations for DDR, eMMC, and flash memory components may fluctuate. Confirm that the specific suffix indicates the correct processor grade and memory configuration for your design requirements. Check for any End-of-Life notifications or discontinuance alerts from Trenz Electronic before finalizing procurement plans.

Selection Notes

Select this module when a compact SOM solution is required with integrated FPGA and processor resources. Ensure compatibility with carrier boards supporting the 4x5 cm footprint and necessary interface protocols. Verify power supply requirements match the module's specifications for stable operation within the industrial temperature range.

Part Context

This part belongs to the TE0820 series of System-on-Modules from Trenz Electronic, which utilizes Xilinx/AMD Zynq UltraScale+ MPSoC technology. The series offers various configurations differing in processor speed grades, memory capacity, and interface options, all maintaining a standardized 4x5 cm form factor for easy integration into custom carrier designs.

Replacement Considerations

Direct public substitutes are not explicitly listed in the provided documentation. Consider evaluating other modules within the TE0820 series with similar processor cores but different memory or interface configurations. Cross-reference with generic Zynq UltraScale+ SOM solutions if form factor constraints allow.