TE0820-05-3BI21ML

Overview

The TE0820-05-3BI21ML is a System-on-Module (SOM) from Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU3CG-1SFVC784E processor, providing combined FPGA and ARM processing capabilities. The module includes 2 GB of installed DDR4 RAM to support high-bandwidth data handling. It features a compact form factor measuring 4 cm by 5 cm, suitable for space-constrained designs. Key interface options include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0, enabling versatile connectivity for industrial and commercial systems.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5F processors alongside programmable logic fabric.

Applications

• Industrial automation controllers requiring real-time processing and field programmability.
• Medical imaging devices needing high-speed data acquisition and display output.
• Automotive infotainment and instrument cluster systems utilizing robust connectivity interfaces.

Procurement Notes

Verify the specific processor variant against project requirements, as the model designation implies a particular silicon grade. Confirm availability status directly with Trenz Electronic or authorized distributors, as supply levels may fluctuate. Ensure that the selected module version matches the required operating temperature range and interface configurations for the target application environment.

Selection Notes

Select this module when a compact solution combining FPGA flexibility with ARM processing power is required. Consider the 2 GB DDR4 capacity for applications involving complex image processing or large data buffers. Evaluate the available interfaces such as PCIe and SATA against system peripheral needs. Verify mechanical compatibility with carrier boards due to the specific 4x5 cm footprint.

Part Context

This component belongs to the Trenz Electronic TE0820 product family, which utilizes AMD Zynq UltraScale+ MPSoCs. These modules are engineered to accelerate development cycles by providing pre-validated hardware platforms. They serve as core computing units in modular system architectures, allowing engineers to focus on application-specific software and logic design rather than low-level hardware initialization.

Replacement Considerations

Direct replacements within the same form factor are limited to other Trenz Electronic modules using similar Zynq UltraScale+ chips. Cross-manufacturer substitution requires significant redesign of the carrier board and firmware due to differences in pinout definitions, memory controller implementations, and boot configuration strategies.