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The Trenz Electronic TE0823-01-3PIU1MA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC (XCZU3EG) with 1 GB LPDDR4 SDRAM and 8 GB eMMC storage. It features dual 512 Mb QSPI Flash, a Lattice MachXO2 CPLD for system control, and Marvell Alaska 88E1512 Gigabit Ethernet PHY. The module provides rugged board-to-board stacking connectors supporting high-speed transceivers, USB 3.0 OTG, PCIe, SATA, and DisplayPort interfaces.
Verify the specific assembly variant matches the required processor speed grade and temperature rating. Confirm that the initial delivery state of the QSPI Flash and eMMC is unprogrammed unless custom firmware is requested. Ensure the carrier board design accommodates the 40 x 50 mm form factor and utilizes the specified Samtec Razor Beam connectors for mechanical stability.
Select this module when a compact, industrial-rated solution combining ARM Cortex-A53 cores with FPGA fabric is needed. It is suitable for applications requiring robust connectivity via PCIe, SATA, or DisplayPort alongside standard peripherals like Gigabit Ethernet and USB 3.0. Consider thermal management requirements as the operating range depends on the cooling solution.
This module belongs to the TE0823 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are mechanically and largely electrically compatible within the family, allowing for flexible upgrades between different Zynq UltraScale+ variants while maintaining the same carrier board interface.
No public confirmed substitutes are available in the provided documentation. For legacy support, verify if earlier hardware revisions of the TE0823 series are functionally equivalent, noting that component updates may occur without functional changes.