TE0823-01-3PIU1MA

TE0823-01-3PIU1MA

$600.10
  • Description:ICOBOARD
  • Series:TE0823

SKU:23011ce56228 Category: Brand:

  
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Product Detailed Parameters

  • Description:ICOBOARD
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor:Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed:-
  • Flash Size:128MB
  • RAM Size:1GB
  • Connector Type:USB
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0823-01-3PIU1MA

Overview

The Trenz Electronic TE0823-01-3PIU1MA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC (XCZU3EG) with 1 GB LPDDR4 SDRAM and 8 GB eMMC storage. It features dual 512 Mb QSPI Flash, a Lattice MachXO2 CPLD for system control, and Marvell Alaska 88E1512 Gigabit Ethernet PHY. The module provides rugged board-to-board stacking connectors supporting high-speed transceivers, USB 3.0 OTG, PCIe, SATA, and DisplayPort interfaces.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with programmable logic and processing system
  • Includes onboard switch-mode power delivery subsystem with multiple regulators
  • Features rugged board-to-board stacking connectors for high-speed I/Os
  • Equipped with Lattice MachXO2 CPLD for system management and configuration

Applications

  • Industrial automation and control systems
  • Medical imaging devices requiring high-performance processing
  • Automotive infotainment and instrument clusters
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific assembly variant matches the required processor speed grade and temperature rating. Confirm that the initial delivery state of the QSPI Flash and eMMC is unprogrammed unless custom firmware is requested. Ensure the carrier board design accommodates the 40 x 50 mm form factor and utilizes the specified Samtec Razor Beam connectors for mechanical stability.

Selection Notes

Select this module when a compact, industrial-rated solution combining ARM Cortex-A53 cores with FPGA fabric is needed. It is suitable for applications requiring robust connectivity via PCIe, SATA, or DisplayPort alongside standard peripherals like Gigabit Ethernet and USB 3.0. Consider thermal management requirements as the operating range depends on the cooling solution.

Part Context

This module belongs to the TE0823 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are mechanically and largely electrically compatible within the family, allowing for flexible upgrades between different Zynq UltraScale+ variants while maintaining the same carrier board interface.

Replacement Considerations

No public confirmed substitutes are available in the provided documentation. For legacy support, verify if earlier hardware revisions of the TE0823 series are functionally equivalent, noting that component updates may occur without functional changes.

TE0823-01-3PIU1MATE0823-01-3PIU1MA
$600.10
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