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Product Detailed Parameters
- Description：ICOBOARD
- Series：TE0823
- Mfr：Trenz Electronic GmbH
- Package：Bulk
- Module/Board Type：MCU, FPGA
- Core Processor：ARM Cortex-A53, ARM® Cortex®-R5
- Co-Processor：Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
- Speed：-
- Flash Size：128MB
- RAM Size：1GB
- Connector Type：USB
- Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature：-40°C ~ 85°C
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Overview
The Trenz Electronic TE0823-01-3PIU1ML is an industrial-grade system-on-module integrating a Xilinx Zynq UltraScale+ MPSoC (XCZU3EG) with 1 GB LPDDR4 SDRAM and 8 GB eMMC. It features dual 512 Mb QSPI flash, a Lattice MachXO2 CPLD, Marvell Ethernet PHY, and Microchip USB transceiver. The module utilizes rugged Samtec Razor Beam connectors for high-speed I/Os, including GTR lanes, PCIe, SATA, DisplayPort, and USB 3.0.
Feature Summary
- Integrates Xilinx Zynq UltraScale+ MPSoC with dedicated low-power memory and storage
- Includes onboard Lattice MachXO2 CPLD for system control and power sequencing
- Supports multiple high-speed interfaces via robust board-to-board stacking connectors
- Features integrated switch-mode power delivery subsystem with multiple regulators
Applications
- Industrial automation and control systems requiring programmable logic
- High-performance embedded computing platforms
- Medical imaging and diagnostic equipment
- Aerospace and defense avionics modules
Procurement Notes
Verify the specific assembly variant against the datasheet to ensure compatibility with required speed grades and temperature ranges. Confirm that the initial delivery state matches project needs, as the QSPI and eMMC are typically unprogrammed upon shipment. Ensure the carrier board design accommodates the specified mechanical dimensions and connector mating heights.
Selection Notes
Select this module when a compact form factor is required alongside significant processing resources. The inclusion of both DDR4 and eMMC supports complex boot sequences and large data handling. Verify interface requirements against the available MIO pins and PL I/Os routed to the B2B connectors before finalizing the design.
Part Context
This module belongs to the TE0823 series, designed for applications needing a balance of performance and size. It is part of Trenz Electronic's portfolio of 4x5 cm modules, which share mechanical compatibility. The specific suffix indicates the processor variant and memory configuration.
Replacement Considerations
No public confirmed substitutes are identified in the provided documentation. The TE0823 series offers specific integration of the Zynq UltraScale+ MPSoC with onboard peripherals that may require significant redesign if replaced by other SOMs.
FAQ
How is JTAG access managed on the TE0823?
JTAG access to the Xilinx Zynq UltraScale+ is routed through the Lattice MachXO2 CPLD via the B2B connector JM2. The JTAGEN signal determines whether the CPLD or the SoC is accessed.
What is the default boot mode configuration?
The module defaults to QSPI boot mode when the MODE signal is Low. Setting the MODE signal High configures the module for SD Card boot.
Which components handle the Gigabit Ethernet connectivity?
The Marvell Alaska 88E1512 PHY provides the Gigabit Ethernet interface, connecting to the Zynq PS GEM0 via RGMII. SGMII signals are also available on the B2B connector.
