ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：ICOBOARD
- Series：TE0823
- Mfr：Trenz Electronic GmbH
- Package：Bulk
- Module/Board Type：MCU, FPGA
- Core Processor：ARM Cortex-A53, ARM® Cortex®-R5
- Co-Processor：-
- Speed：-
- Flash Size：-
- RAM Size：-
- Connector Type：USB
- Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature：-40°C ~ 85°C
Download product information
Overview
The Trenz Electronic TE0823-01-S001 is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC (XCZU3EG) with 1 GB LPDDR4 SDRAM and 8 GB eMMC. It features dual 512 Mb QSPI flash, a Lattice MachXO2 CPLD, Marvell Alaska 88E1512 Ethernet PHY, and Microchip USB3320 transceiver. The module utilizes rugged Samtec Razor Beam connectors for high-speed I/Os, including GMII, SATA, PCIe, and DisplayPort.
Feature Summary
- Integrates low-power Xilinx Zynq UltraScale+ MPSoC with programmable logic
- Includes onboard switch-mode power delivery subsystem with multiple regulators
- Features robust board-to-board stacking connectors for high-speed transceivers
- Equipped with Lattice MachXO2 CPLD for system control and configuration
Applications
- Industrial automation and embedded digital signal processing
- High-speed data acquisition systems
- Automotive industry applications
- PC-based process control and measurement systems
Procurement Notes
Verify the specific assembly version against the datasheet to confirm memory capacity and processor speed grade. Confirm that the required operating temperature range aligns with the industrial specifications provided in the technical documentation. Ensure compatibility with the intended carrier board connector mating height and electrical ratings before integration.
Selection Notes
Select this module for designs requiring a compact 4x5 cm form factor with integrated power management. Consider the available MGT lanes and PL I/O counts when planning high-speed interface requirements. Verify that the onboard peripherals, such as the specific Ethernet PHY and USB transceiver, meet the application's connectivity needs without additional external components.
Part Context
This module belongs to the TE0823 series of System-on-Modules designed by Trenz Electronic GmbH. These modules are engineered for industrial environments and are mechanically compatible with other 4x5 cm form factor products in the lineup. They support various Xilinx Zynq UltraScale+ device variants within the same physical footprint.
Replacement Considerations
No public confirmed substitutes are documented. As this is a specialized industrial SoM, alternative solutions require evaluating mechanical compatibility, pinout mapping, and software ecosystem support independently.
FAQ
How is JTAG access managed on the TE0823?
JTAG access to the Xilinx Zynq UltraScale+ is routed through the Lattice MachXO2 CPLD via the B2B connector JM2.
What is the default boot mode configuration?
The module defaults to QSPI boot mode when the MODE signal is Low. SD Card boot is selected when the MODE signal is High.
Which Ethernet PHY is integrated on the module?
The module uses the Marvell Alaska 88E1512 Gigabit Ethernet PHY, connected via RGMII to the PS GEM0.
