TE0841-02-040-1C

Overview

The TE0841-02-040-1C is a 4 x 5 cm FPGA module integrating the Xilinx Kintex UltraScale KU040 (XCKU040-1SFVA784C). It includes 2 GByte DDR4 SDRAM and 64 MByte QSPI Flash. The module utilizes three Razor Beam connectors providing 260 terminals, supporting 56 HR user I/Os, 84 HP user I/Os, eight GTH serial transceiver lanes, and two GT clock inputs. A Si5338 PLL generates clocks for the processing system and programmable logic.

Feature Summary

• Integrates Xilinx Kintex UltraScale KU040 FPGA with dedicated high-speed memory subsystem
• Supports single supply operation via onboard switch-mode power delivery
• Provides rugged board-to-board stacking connectors for extensive I/O access
• Includes integrated clocking solution with LVDS oscillator and multi-output PLL

Applications

• Industrial automation systems requiring robust programmable logic
• High-performance data acquisition and signal processing applications
• Embedded digital signal processing architectures
• Custom hardware prototyping for commercial temperature environments

Procurement Notes

This component is manufactured on demand rather than held in standard inventory. Customers must contact the manufacturer or authorized distributors to inquire about specific minimum order quantities and current availability status. Production schedules are subject to customer order volume and lead time constraints defined by Trenz Electronic at the time of purchase.

Selection Notes

Select this module for designs requiring the specific performance characteristics of the Xilinx Kintex UltraScale KU040 within a compact 4 x 5 cm footprint. Ensure the application environment remains within the commercial temperature range of 0°C to +70°C. Verify that the host carrier board supports the required 260-terminal Razor Beam interface and provides adequate thermal management for the specified power delivery architecture.

Part Context

Trenz Electronic specializes in embedded development services and FPGA-based solutions. This module belongs to their Micromodule series, designed for compatibility with various carrier boards. The company focuses on industrial and automotive applications, offering turnkey design support alongside standard modular components for rapid prototyping and production deployment.

Replacement Considerations

Modules within the same 4 x 5 cm form factor family offer mechanical and largely electrical compatibility. Engineers should verify pinout alignment and voltage domain matching when substituting with other variants from the TE0841 series or compatible Trenz Electronic modules to ensure seamless integration into existing carrier board designs.