TE0841-02-040-1I

Overview

The TE0841-02-040-1I is a 4 x 5 cm industrial-grade FPGA module integrating the Xilinx Kintex UltraScale XCKU040-1SFVA784I. It features 2 GByte of 16-bit wide DDR4 memory and 32 MByte QSPI Flash for configuration. The module utilizes three Razor Beam connectors providing 260 terminals, including 56 HR user I/Os, 84 HP user I/Os, and eight GTH serial transceiver lanes. It operates within an industrial temperature range of -40°C to +85°C and supports single-supply operation with onboard switch-mode power supplies.

Feature Summary

• Integrates Xilinx Kintex UltraScale XCKU040-1SFVA784I FPGA
• Includes 2 GByte 16-bit DDR4 and 32 MByte QSPI Flash
• Features rugged high-speed stacking strips with 260 terminals
• Supports single-supply operation via onboard switch-mode power supplies

Applications

• Industrial automation systems requiring robust FPGA processing
• High-performance signal processing applications utilizing GTH transceivers
• Embedded control modules needing compact form factor and industrial temperature tolerance

Procurement Notes

Verify component authenticity through authorized Trenz Electronic distributors or direct channels. Confirm current availability status as product lifecycle stages may affect supply. Ensure compatibility with baseboard designs regarding mechanical footprint and electrical interface specifications before procurement.

Selection Notes

Select this module for applications requiring the specific performance characteristics of the XCKU040-1SFVA784I within a standard 4 x 5 cm footprint. Consider the available I/O distribution across HR and HP banks when designing peripheral interfaces. Evaluate thermal management requirements based on the customer's cooling solution, as operating temperature depends on system design.

Part Context

This module belongs to the Trenz Electronic TE0841 series, designed for compact embedded FPGA solutions. It is part of a family of mechanically compatible modules sharing the 4 x 5 cm form factor, allowing for potential migration between different FPGA densities while maintaining board layout consistency.

Replacement Considerations

Modules within the same 4 x 5 cm form factor family offer mechanical compatibility. Verify electrical pinout and resource availability differences when substituting with other variants in the TE0841 series or similar Trenz Electronic micromodules.