TE0841-02-0401IL

Overview

The TE0841-02-0401IL is a System-on-Module manufactured by Trenz Electronic. It integrates an AMD Xilinx Zynq UltraScale+ RFSoC FPGA, specifically the XCZU7EV-2SFVC1924I variant. The module features 2 GB of DDR4 SDRAM and 32 GB of e.MMC storage. It operates within an industrial temperature range of -40°C to +85°C. The physical dimensions are 40 mm x 50 mm. Key interfaces include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ RFSoC for combined processing and high-speed data conversion
• Includes onboard switch-mode power delivery with multiple DC/DC converters and LDO regulators
• Supports rugged board-to-board stacking connectors for high-speed transceiver I/O
• Features ultra-low jitter PLL for clock distribution to serial transceivers

Applications

• High-speed data acquisition systems requiring precise measurement capabilities
• Embedded digital signal processing applications based on FPGA and CPU architectures
• Industrial automation and process control systems operating in harsh environments
• Automotive infotainment and advanced driver-assistance systems (ADAS) modules

Procurement Notes

Verify current availability status as this component may be subject to limited supply or end-of-life notifications. Confirm that the specific suffix indicates the correct processor grade and memory configuration required for your design. Check for any Product Change Notifications (PCN) issued by Trenz Electronic regarding material or manufacturing updates. Ensure compatibility with existing carrier boards or FMC connectors before procurement.

Selection Notes

Select this module when a compact form factor is needed alongside significant RF processing capabilities. The integrated RFSoC architecture reduces external component count compared to discrete ADC/DAC solutions. Consider the 4x5 cm footprint for space-constrained designs. Verify that the available interfaces such as PCIe and SATA meet the system connectivity requirements without additional bridging logic.

Part Context

This part belongs to the Trenz Electronic TE08xx series of System-on-Modules designed for demanding embedded applications. These modules typically leverage Xilinx Zynq UltraScale+ MPSoC or RFSoC devices. The series is characterized by its small 4x5 cm footprint and integration of robust power management subsystems. Trenz Electronic provides these modules to accelerate development cycles for industrial and automotive customers.

Replacement Considerations

No direct public substitutes are confirmed for this specific configuration. Alternative solutions would require evaluating other SOM vendors offering similar RFSoC integration. Design changes may be necessary due to differences in pinout, power sequencing, and mechanical mounting holes. Validate thermal performance if replacing with a module having different power dissipation characteristics.