TE0841-02-31C21-A

Overview

The TE0841-02-31C21-A is an industrial-grade System-on-Module integrating a Xilinx Kintex UltraScale FPGA with 2 GByte of DDR4 SDRAM and 64 MByte QSPI Flash. It features three Samtec Razor Beam connectors providing 60 HR I/Os, 84 HP I/Os, and eight GTH transceiver lanes. The module operates on a single 3.3V supply within a -40°C to +85°C temperature range.

Feature Summary

• Integrates Xilinx Kintex UltraScale FPGA with high-speed GTH transceivers
• Includes onboard switch-mode power supplies for all voltages
• Features rugged board-to-board stacking connectors for signal integrity
• Supports single 3.3V input power source operation

Applications

• Industrial automation control systems
• High-speed data acquisition modules
• Telecommunications infrastructure equipment
• Medical imaging processing units

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current variant list to confirm component availability and revision status. Confirm mechanical mating height requirements with the carrier board design prior to procurement. Ensure compliance with environmental specifications for the intended deployment location.

Selection Notes

Select this module for applications requiring high-performance FPGA logic with substantial memory bandwidth. Verify that the carrier board supports the required number of GTH lanes and I/O bank voltages. Consider thermal management solutions as power consumption varies significantly with the FPGA design complexity.

Part Context

This part belongs to the Trenz Electronic 4x5 cm SoM family, designed for compact embedded computing. It utilizes standard Samtec Razor Beam connectors for mechanical compatibility with other modules in the series. The module serves as a core processing unit for custom carrier boards in demanding environments.

Replacement Considerations

Check for updated revisions within the TE0841 series. Consult the manufacturer for direct substitutes if the specific FPGA density or memory configuration is unavailable. Ensure any replacement maintains the same form factor and connector pinout for mechanical interchangeability.