TE0841-02-32I21-A

Overview

The TE0841-02-32I21-A is an industrial-grade system-on-module integrating a Xilinx Kintex UltraScale FPGA (XCKU035 or XCKU040) with 2 GByte of DDR4 SDRAM and 64 MByte QSPI Flash. It features three Samtec Razor Beam connectors providing 60 HR I/Os, 84 HP I/Os, and eight GTH transceiver lanes. The module includes on-board power management, a programmable Si5338 clock generator, and a System Controller CPLD for boot control.

Feature Summary

• Integrates Xilinx Kintex UltraScale FPGA with dual-bank DDR4 memory
• Supports single 3.3V input via onboard switch-mode power supplies
• Includes Lattice MachXO2 System Controller CPLD for power sequencing
• Features rugged Samtec Razor Beam board-to-board interconnects

Applications

• Industrial automation controllers
• High-speed data acquisition systems
• Telecommunications infrastructure equipment
• Medical imaging devices

Procurement Notes

Verify the specific FPGA variant (XCKU035 vs XCKU040) required for your design performance needs. Confirm that the carrier board utilizes compatible Samtec Razor Beam connectors with appropriate stacking heights to ensure signal integrity. Ensure the power supply meets the minimum current capability recommendations during startup.

Selection Notes

Select this module when high-density I/O and high-speed serial connectivity are required in a compact form factor. The inclusion of dedicated MGT lanes supports complex communication protocols. Consider the thermal requirements of the Kintex UltraScale device and ensure adequate cooling solutions are integrated into the carrier board design.

Part Context

This module belongs to Trenz Electronic's 4x5 cm SoM family, designed for mechanical compatibility across variants. It serves as a core processing unit for embedded applications requiring FPGA flexibility combined with standard memory interfaces. The TE0841 series is optimized for industrial environments with robust power delivery and configuration management.

Replacement Considerations

Direct pin-compatible replacements are not publicly documented for this specific custom SoM configuration. Alternative designs would require significant carrier board redesign to accommodate different FPGA footprints and memory architectures. Consult Trenz Electronic for updated module revisions or alternative form factors.