TE0841-02-41I21-L

Overview

The TE0841-02-41I21-L is an industrial-grade system-on-module integrating a Xilinx Kintex UltraScale FPGA, 2 GByte DDR4 SDRAM, and 64 MByte QSPI Flash. It features eight GTH transceiver lanes, numerous configurable I/Os via Samtec Razor Beam connectors, and on-board power management. The module supports single 3.3V operation with optimized signal integrity through evenly spread supply pins.

Feature Summary

• Integrates Xilinx Kintex UltraScale FPGA with high-performance processing capabilities
• Includes 2 GByte DDR4 SDRAM and 64 MByte QSPI Flash for configuration and data storage
• Features eight GTH transceiver lanes for high-speed serial communication
• Utilizes rugged Samtec Razor Beam connectors for reliable board-to-board interfacing

Applications

• Industrial automation systems requiring robust FPGA processing
• High-speed data acquisition and signal processing applications
• Complex embedded control systems with extensive I/O requirements
• Prototyping platforms for advanced digital logic designs

Procurement Notes

Verify the specific FPGA variant (XCKU035 or XCKU040) required for your design, as availability may vary. Confirm that the carrier board supports the required stacking height and mating specifications for the Samtec Razor Beam connectors. Ensure the power supply meets the recommended 3.3V input with sufficient current capability for startup conditions.

Selection Notes

Select this module when a compact, industrial-grade solution with integrated memory and high-speed transceivers is needed. Consider the thermal performance and cooling requirements based on the FPGA load. Verify compatibility with the target carrier board's connector height and electrical specifications to ensure proper signal integrity and mechanical fit.

Part Context

This module belongs to the Trenz Electronic 4x5 cm SoM family, designed for mechanical compatibility across variants. It serves as a building block for custom carrier boards, providing a pre-integrated FPGA solution with peripheral components. The series targets applications demanding high reliability and performance in a small form factor.

Replacement Considerations

Direct replacements are limited due to the specific integration of Xilinx FPGAs and Trenz Electronic's proprietary carrier interface. Evaluate other modules from the same manufacturer with similar FPGA families and memory configurations. Ensure any alternative supports the required transceiver lanes and I/O count for functional equivalence.