TE0890-01-25-1C

Overview

The TE0890-01-25-1C is a fully open-source FPGA module integrating the Xilinx Spartan-7 XC7S25-1FTGB196C device. It features 23K logic cells, 29K flops, 45 36Kb BRAMs, and 80 multipliers. The module includes 64 MBit HyperRAM DRAM for video frame buffering and 64 MBit Config PROM for dual-boot or software storage. It supports 32 or 64 I/Os via DIP-40 or 80-pin connectors and operates within a commercial temperature range of 0°C to +70°C.

Feature Summary

• Fully open-source design with footprint compatibility for 7S6, 7S15, and 7S50 FTGB-196 devices
• Integrated 64 MBit HyperRAM DRAM suitable for video frame buffer applications
• Dual-pinout connector options supporting 32 or 64 FPGA 3.3V I/Os
• Includes 64 MBit Config PROM enabling dual-boot and software code storage

Applications

• Prototyping and development using free Vivado WebPACK tools
• Video processing systems utilizing integrated HyperRAM as a frame buffer
• Embedded logic designs requiring dual-boot configuration capabilities
• Educational projects leveraging fully open-source hardware resources

Procurement Notes

Verify that the specific ordering suffix matches the required I/O pin count and connector type. Confirm that the commercial temperature range meets project requirements. Ensure the host system provides the specified 5V supply input voltage. Check for availability of reference designs and documentation on the manufacturer wiki before finalizing procurement decisions.

Selection Notes

Select this module when footprint compatibility with other Spartan-7 devices is required. Choose this option for designs needing integrated memory without external components. Consider this part for cost-sensitive applications supported by free synthesis tools. Evaluate the 3.3V I/O levels against target interface requirements.

Part Context

This module belongs to the S7 Mini series by Trenz Electronic GmbH, designed for compact FPGA implementations. It targets developers seeking open-source hardware solutions based on AMD/Xilinx Spartan-7 technology. The product line emphasizes ease of integration through standardized footprints and included peripheral memory.

Replacement Considerations

The module is footprint compatible with 7S6, 7S15, and 7S50 FTGB-196 devices. These variants offer different resource counts while maintaining mechanical interchangeability. Verify logic cell and BRAM requirements when substituting with these compatible parts.