TEA2025D

Overview

The TEA2025D is a dual-channel Class AB audio power amplifier IC manufactured by STMicroelectronics, housed in a 20-SO surface-mount package. It operates on a supply voltage ranging from 3V to 12V and supports both stereo and bridge-tied load (BTL) configurations. In stereo mode at 9V with an 8Ω load, it delivers 1.3W per channel; in BTL mode, it provides 4.7W into an 8Ω load. The device features high channel separation, low switch-on/off noise, soft clipping, and thermal protection.

Feature Summary

• Supports dual or bridge connection modes for flexible audio output configurations
• Integrates thermal protection and soft clipping to safeguard the circuit under stress
• Features very low switch-on/off noise to minimize audible pop sounds during operation
• Requires few external components due to built-in decoupling and start-up circuits

Applications

• Portable radio cassette players
• Stereo audio amplification systems
• Bridge power audio amplifier setups

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation, as the TEA2025D may be discontinued or superseded by variants like the TEA2025D013TR. Confirm that the 20-SO package dimensions match your PCB footprint requirements. Ensure compatibility with the required supply voltage range of 3V to 12V for your target application before finalizing procurement.

Selection Notes

Select the TEA2025D when a compact surface-mount solution is required for dual-channel audio amplification. It is suitable for designs needing bridge-tied load capabilities without complex external wiring. Consider its 3V minimum operating voltage for battery-powered applications. Verify that the thermal resistance characteristics of the SO20 package meet your heat dissipation needs for the expected output power levels.

Part Context

The TEA2025D belongs to the TEA2025 family of monolithic integrated circuits designed for portable audio equipment. While the TEA2025B utilizes a PowerDIP 16-pin through-hole package, the TEA2025D variant specifically employs a 20-SO surface-mount package. Both share identical electrical characteristics and functional block diagrams, differing primarily in physical packaging and pinout arrangement for board integration.

Replacement Considerations

The TEA2025B serves as a direct functional equivalent but uses a PowerDIP 16+2+2 through-hole package instead of the SO20 surface-mount format. Designers must account for significant differences in mounting style and pin configuration when substituting between these two package types.