TEC0117-01

Overview

The TEC0117-01 is a system-on-module manufactured by Trenz Electronic GmbH, designed for embedded applications. It integrates the Gowin LittleBee FPGA platform, specifically utilizing the GW5AST-LV18/25 series devices. This module provides a compact solution for logic processing and I/O expansion in space-constrained environments.

Feature Summary

• Integrates Gowin LittleBee FPGA technology for high-density logic implementation
• Designed as a complete system-on-module for rapid prototyping and deployment
• Supports embedded computing tasks within a standardized form factor

Applications

• Industrial control systems requiring compact FPGA solutions
• Embedded logic processing units
• Rapid prototyping of digital designs using Gowin architecture

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm specific revision levels and packaging details prior to order placement. Ensure compatibility with host board design specifications regarding pinout and power requirements.

Selection Notes

Select this module when a compact FPGA-based solution is required. Consider the specific logic capacity of the integrated Gowin device against application demands. Evaluate thermal management needs based on the module's operating environment and load conditions.

Part Context

This part belongs to the Trenz Electronic product line focusing on FPGA modules. It complements other development boards and carrier cards offered by the manufacturer, providing a core processing element for custom hardware designs.

Replacement Considerations

No public confirmed substitute part numbers are available for this specific model. Alternative selection requires evaluating compatible FPGA modules from other manufacturers with similar form factors and logic capabilities.