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TI120L484C3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The TI120L484C3L is a Titanium™ series Field Programmable Gate Array (FPGA) manufactured by Efinix, Inc. It features 120 DSP blocks and supports up to 260 user I/Os within a 484-ball FineLine BGA package measuring 25x25 mm. The device includes 176,947 logic elements and 13,110,000 total RAM bits. It operates with a core voltage range of 0.92V to 0.98V and supports an industrial temperature range of -40°C to +85°C. The component utilizes the Efinity software environment for configuration and design implementation.
Verify the specific suffix 'L' indicates the industrial temperature grade (-40°C to +85°C) as per official Efinix documentation. Confirm package dimensions and pinout compatibility with target PCB layout. Ensure the Efinity software license matches the device density. Check for any recent Product Change Notifications regarding lead or material composition updates.
Compare against TI90J484C3 for lower resource requirements or TI180J361C4 for higher capacity needs. Evaluate power consumption profiles against system thermal constraints. Verify that the 484-ball BGA package fits within the available board space and manufacturing capabilities. Consider the availability of development kits for initial prototyping and validation.
This component belongs to the Titanium™ FPGA family from Efinix, designed for mid-to-high performance applications requiring significant DSP and logic resources. It shares the same 484-ball package form factor as other Titanium devices like the TI90 and TI180 series, facilitating potential platform consistency across different project phases.
Direct substitutes include other Titanium series FPGAs in the 484-ball package such as TI90J484C3 or TI180J361C4, subject to resource and pinout compatibility verification. Cross-family replacements require careful evaluation of architectural differences and software toolchain support.
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