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TI180J484I3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The Efinix Titanium Ti180J484I3L is a high-performance Field Programmable Gate Array (FPGA) belonging to the Titanium family, designed for complex digital logic applications. It features a J484 package with 484 I/O pins and operates within an industrial temperature range of -40°C to +100°C. The device supports advanced signal processing and connectivity requirements through its integrated architecture. Power management for this platform is optimized using reference designs involving Rohm components such as the BD95602MUV, BD9F500QUZ, and BD9F800MUX, which provide necessary current capabilities and voltage regulation for stable FPGA operation in demanding environments.
Verify component authenticity by checking manufacturer markings against official datasheets. Ensure compatibility with existing PCB layouts, particularly regarding the J484 package dimensions. Confirm that power supply designs align with recommended reference circuits to maintain signal integrity and thermal performance during operation.
Select this model when high I/O count and industrial temperature resilience are required. Consider the specific power management requirements associated with the Titanium series, ensuring that external power components match the specified input voltage ranges and current capabilities for optimal system stability and efficiency.
This component is part of the Efinix Titanium FPGA family, targeting applications needing high throughput and low latency. It complements other devices in the lineup by offering a balance of programmability and fixed-function peripherals, making it suitable for next-generation communication and industrial automation systems.
Direct substitutes may include other models within the Efinix Titanium series with compatible pin counts. Verify electrical characteristics and package dimensions before replacement. Cross-referencing with similar FPGAs from other manufacturers requires careful evaluation of I/O standards and power consumption profiles.
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