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TI375C1156I3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The Efinix Titanium Ti375C1156I3L is a Field Programmable Gate Array (FPGA) belonging to the Titanium family, designed for high-performance edge computing and machine vision applications. It utilizes the Quantum architecture and features an integrated hardened RISC-V processor subsystem with four CPU cores, each equipped with a dedicated Floating Point Unit (FPU). The device provides up to 375,000 logic elements and includes hardened LPDDR4/LPDDR4X memory controllers. Key interface capabilities include multiple MIPI D-PHY interfaces supporting data rates up to 2.5 Gbps per lane, alongside soft-core MIPI support at 1.5 Gbps. The component is housed in a 1156-ball FineLine BGA package.
Verify the specific suffix 'I3L' against official Efinix documentation to confirm temperature range and package variant details. Ensure compatibility with the Efinity software toolchain version required for the Titanium architecture. Confirm availability of development kits such as the Ti375C529 for prototyping purposes before finalizing procurement plans.
Select this model when a balance between high logic density and embedded processing capability is required. The presence of hardened MIPI interfaces makes it suitable for direct camera sensor integration without additional bridge chips. Consider the 1156-ball package size for board space constraints compared to smaller variants like the Ti125 or larger ones like the Ti375C529.
This component is part of the Efinix Titanium family, which sits above the Topaz series in terms of performance and below the high-end Titanium Ti375 in specific configuration contexts. It shares the core Quantum architecture with other Titanium devices but offers a specific mix of logic resources and embedded processors tailored for cost-sensitive yet high-performance edge applications.
Direct pin-to-pin replacements within the same package are limited. Evaluate the Ti375C529 for higher performance needs or the Ti125/Ti70 for lower resource requirements. Cross-family migration to Topaz requires significant architectural redesign due to differences in embedded processor availability and I/O configurations.
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