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TI60F256I3 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The TI60F256I3 is a Titanium™ Field Programmable Gate Array (FPGA) integrated circuit manufactured by Efinix, Inc. It features 184 input/output pins and contains 62,016 logic elements or cells. The device includes 2,726,298 total RAM bits and three Phase-Locked Loops (PLLs). It operates within a supply voltage range of 0.92V to 0.98V and supports an operating temperature range of -40°C to 100°C (TJ). The component is packaged in a 256-TFBGA format with dimensions of 14x14mm.
Verify the specific suffix 'I3' against the official Efinix datasheet to confirm industrial temperature rating and package variant. Ensure compatibility with the 100-TFBGA family pinout if substituting from smaller packages like the 100-ball variant. Confirm RoHS compliance status through the manufacturer's current documentation before finalizing procurement orders.
Select this model when 184 I/Os are required alongside significant logic resources. Compare against the TI60F100 series if fewer pins suffice, as they share similar core architectures. Verify that the 256-ball BGA footprint fits the target PCB constraints. Ensure design tools support the Titanium™ series programming requirements.
This part belongs to the Titanium™ family of FPGAs from Efinix, designed for compute-intensive applications. It shares architectural similarities with other Ti60 variants but offers increased I/O density compared to the 100-ball versions. The series targets edge computing and industrial markets requiring low power consumption and high parallel processing capabilities.
Direct substitutes include other Ti60 family members such as TI60F100 variants, though pin counts differ. Cross-series migration to Trion™ devices requires re-evaluation of logic and memory resources. Verify mechanical footprint compatibility when considering alternative package options within the same product line.
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