TIBPAL16L8-30MJ

TIBPAL16L8-30MJ

  • Description:LOW-POWER HIGH-PERFORMANCE IMPAC
  • Mfr:Texas Instruments

SKU:a568e4e1842c Category: Brand:

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Product Detailed Parameters

  • Description:LOW-POWER HIGH-PERFORMANCE IMPAC
  • Mfr:Texas Instruments
  • Package:Tube
  • Series:-
  • Programmable Type:PAL
  • Number of Macrocells:8
  • Voltage - Input:4.5V ~ 5.5V
  • Speed:30 ns
  • Mounting Type:Through Hole
  • Package / Case:20-CDIP (0.300", 7.62mm)
  • Supplier Device Package:20-CDIP

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TIBPAL16L8-30MJ

Overview

The TIBPAL16L8-30MJ is a low-power high-performance IMPACT PAL circuit featuring 16 inputs and 8 combinational outputs. It utilizes Advanced Low-Power Schottky technology with titanium-tungsten fuses for reliable operation. The device operates within a supply voltage range of 4.5 V to 5.5 V, supporting a maximum clock frequency of 25 MHz. Propagation delay from input to output is typically 15 ns with a maximum of 30 ns. Enable and disable times are typically 14 ns and 13 ns respectively.

Feature Summary

  • Combines Advanced Low-Power Schottky technology with titanium-tungsten fuses
  • Functionally equivalent but faster than standard PAL16L8A devices
  • Supports full military temperature range operation from -55°C to 125°C
  • Available in both plastic and ceramic DIP packages

Applications

  • High-speed logic replacement in industrial control systems
  • Custom function design for compact circuit boards
  • Military-grade digital signal processing interfaces
  • State-machine initialization in aerospace applications

Procurement Notes

Verify the specific package suffix 'J' corresponds to the required CDIP form factor. Confirm that the 'M' suffix aligns with the necessary -55°C to 125°C operating temperature range for your application environment. Ensure programming equipment supports titanium-tungsten fuse architectures. Check current production status as legacy PLDs may have limited availability or require alternative sourcing strategies.

Selection Notes

Select this component when replacing older PAL16L8A designs requiring improved speed and lower power consumption. The M suffix indicates suitability for harsh environments requiring extended temperature tolerance. Consider the CDIP package if through-hole mounting is mandatory. Evaluate board space constraints as chip carriers offer further reduction compared to standard DIP formats.

Part Context

This device belongs to the TIBPAL16 series of low-power high-performance IMPACT PAL circuits. It serves as a direct upgrade path for conventional TTL logic implementations. The family includes registered variants like TIBPAL16R4 and TIBPAL16R8, offering different output configurations while maintaining compatible pinouts and programming structures.

Replacement Considerations

Direct functional equivalents include the TIBPAL16L8-30MJB and TIBPAL16L8-30MW. Verify package compatibility when substituting between CDIP, CFP, and LCCC options. Ensure programming algorithms account for the specific fuse map differences between IMPACT and earlier PAL generations.

TIBPAL16L8-30MJTIBPAL16L8-30MJ

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