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TLC2274IPW is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 4 CIRCUIT 14TSSOP. Review the specifications below when checking this part for your BOM.
The TLC2274IPW is a quadruple AdvancedLinCMOS rail-to-rail operational amplifier from Texas Instruments, housed in an 8-pin TSSOP package. It features a typical gain-bandwidth product of 2.18 MHz and a slew rate of 3.6 V/µs at unity gain. The device operates on supply voltages ranging from ±2.2 V to ±8 V. Key electrical characteristics include a typical input bias current of 1 pA and an equivalent input noise voltage of 9 nV/√Hz at 1 kHz. The maximum input offset voltage is 2500 µV for the standard grade.
Verify the specific suffix 'PW' corresponds to the TSSOP package type when ordering. Confirm the temperature grade (C, I, Q, or M) matches the required operating environment, as electrical characteristics vary by grade. Ensure the design accounts for the thermal resistance values provided in the datasheet to maintain junction temperatures within absolute maximum ratings during operation.
Select this component when multiple operational amplifiers are needed in a compact surface-mount footprint. It serves as a direct upgrade to the TLC274 family, offering improved noise performance and wider output swing. Consider the TLC2274IPW for designs requiring low power consumption alongside moderate bandwidth and precision signal conditioning capabilities.
This part belongs to the TLC227x family of AdvancedLinCMOS rail-to-rail operational amplifiers. The family includes dual (TLC2272) and quadruple (TLC2274) variants. The IPW designation indicates the industrial temperature grade version packaged in a thin-shrink small-outline package (TSSOP). This family is designed to replace older CMOS op-amps with better AC performance and lower power dissipation.
The TLC2274 is documented as an upgrade replacement for the TLC274. Designers should verify pin compatibility and ensure that the improved noise and offset specifications meet the new application requirements without necessitating circuit redesign.
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