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The TLD1120ELXUMA1 is a single-channel high-side LED driver IC from Infineon Technologies, part of the LITIX Basic family. It operates within an input voltage range of 5.5 V to 40 V and delivers a maximum output current of 360 mA. The device is housed in a PG-SSOP-14-EP package with exposed pad for enhanced thermal performance. It supports PWM dimming control and includes integrated short circuit and thermal protection features. The component is qualified to AEC-Q100 standards, ensuring reliability for automotive applications across a temperature range of -40°C to +150°C.
Verify the specific ordering suffix ELXUMA1 to confirm the reel packaging format and tape width specifications required for your assembly line equipment. Ensure that the PG-SSOP-14-EP package footprint matches your PCB design, particularly noting the exposed pad requirements for thermal dissipation and electrical grounding. Confirm AEC-Q100 qualification status if your application mandates automotive-grade reliability standards before finalizing procurement orders.
Select this component when a single-channel solution with up to 360 mA drive current is sufficient for the target LED load. Consider the 5.5 V to 40 V input range compatibility with standard automotive electrical systems. Evaluate the thermal management capabilities provided by the SSOP-14 package with exposed pad against the expected power dissipation in the specific application environment to ensure stable operation under varying load conditions.
This device belongs to the LITIX Basic series of LED drivers designed for robust and cost-effective lighting solutions. It integrates essential protection features typically found in higher-end automotive lighting controllers. The single-channel configuration simplifies board layout compared to multi-channel alternatives while maintaining the core functionality required for standard LED string driving in automotive environments.
Check for direct substitutes within the TLD11xx series or other LITIX Basic variants that offer similar channel counts and current ratings. Verify pin-to-pin compatibility if replacing existing designs, as package dimensions and exposed pad configurations must align precisely with the original PCB footprint.