TLP121(Y-TPL,F)

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:8935bf12e1da Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：50% @ 5mA
Current Transfer Ratio (Max)：150% @ 5mA
Turn On / Turn Off Time (Typ)：3µs, 3µs
Rise / Fall Time (Typ)：2µs, 3µs
Input Type：DC
Output Type：Transistor
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 100°C
Mounting Type：Surface Mount
Package / Case：6-SMD (4 Leads), Gull Wing
Supplier Device Package：6-MFSOP, 4 Lead

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TLP121(Y-TPL,F)

Overview

The TLP121(Y-TPL,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a photo-transistor in a mini flat DIP-4 plastic package. The device provides an isolation voltage of 3750 Vrms and a collector-emitter breakdown voltage of at least 80 V. The standard current transfer ratio is 50% minimum, while the Y-rank variant guarantees a minimum current transfer ratio of 100%. It operates within a temperature range of -25°C to 85°C.

Feature Summary

Integrates a GaAs infrared LED with a photo-transistor for optical signal transmission
Provides high electrical isolation via a 3750 Vrms insulation barrier
Offers enhanced current transfer performance in the Y-rank configuration
Designed for surface mount assembly in compact mini flat packages

Applications

Office machines such as copiers and laser beam printers
Programmable controllers for industrial automation
AC/DC input modules for power supply interfaces
Telecommunication equipment signal isolation

Procurement Notes

Verify the specific suffix (Y-TPL,F) against official Toshiba documentation to confirm the exact current transfer ratio rank and lead-free status. Ensure the component meets UL 1577 recognition requirements if safety certification is mandatory for the target application. Cross-reference datasheet revisions to confirm parameter consistency.

Selection Notes

Select this component when high current transfer efficiency is required in a small surface-mount footprint. The Y-rank designation indicates superior gain compared to standard variants. Consider the 80V collector-emitter voltage limit and 50mA maximum forward current constraints during circuit design. Evaluate thermal management needs within the specified operating temperature range.

Part Context

This part belongs to the TLP121 series of mini flat couplers designed for space-constrained applications. The series utilizes a plastic DIP-4 package suitable for automated surface mount assembly. Toshiba positions these devices for reliable signal isolation in consumer electronics and industrial control systems requiring compact form factors.