TLP137(BV,F)

Overview

The TLP137(BV,F) is a mini flat coupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode optically coupled to a photo transistor, designed for surface mount assembly. The device provides high current transfer ratio at low input currents. Key electrical specifications include a collector-emitter voltage of 80 V minimum and an isolation voltage of 3750 Vrms minimum. The BV variant ensures a minimum current transfer ratio of 200%. It is housed in a small outline package suitable for automated assembly processes.

Feature Summary

• Integrates a gallium arsenide infrared LED with a photo transistor for optical signal transmission
• Provides high current transfer ratio performance even at low input currents
• Features a mini flat coupler design optimized for surface mount assembly

Applications

• Office machines
• Programmable controllers
• AC/DC input modules
• Telecommunication equipment

Procurement Notes

Verify the specific suffix (BV, F) against the manufacturer's official datasheet to confirm current transfer ratio grades and packaging type. Ensure the component matches the required isolation voltage ratings and pin configuration for the target circuit design before procurement.

Selection Notes

Select this component when high current transfer ratio at low drive currents is required in a compact surface mount package. Consider the 80 V collector-emitter voltage rating and 3750 Vrms isolation capability for applications requiring robust signal isolation between circuits.

Part Context

This part belongs to Toshiba's mini flat coupler series, which are small outline photocouplers designed for space-constrained applications. The series typically includes variants with different current transfer ratios and packaging options to suit various industrial and consumer electronics requirements.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.