TLP181(GR,T)

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:0cbc7c4db69c Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：100% @ 5mA
Current Transfer Ratio (Max)：300% @ 5mA
Turn On / Turn Off Time (Typ)：3µs, 3µs
Rise / Fall Time (Typ)：2µs, 3µs
Input Type：DC
Output Type：Transistor
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 110°C
Mounting Type：Surface Mount
Package / Case：6-SMD (4 Leads), Gull Wing
Supplier Device Package：6-MFSOP, 4 Lead

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TLP181(GR,T)

Overview

The TLP181(GR,T) is a mini flat coupler manufactured by Toshiba Semiconductor and Storage, designed for surface mount assembly. It integrates a gallium arsenide infrared emitting diode optically coupled to a photo transistor within a compact outline package smaller than standard DIP formats. Key electrical specifications include a minimum collector-emitter voltage of 80V and a minimum current transfer ratio of 50%. The device offers a minimum isolation voltage of 3750Vrms and supports a maximum operating isolation voltage of 565Vpk with a withstand voltage of 6000Vpk. It holds UL 1577 certification (file no. E67349) and VDE certification compliant with EN 60747-5-2.

Feature Summary

Compact mini flat form factor suitable for high-density surface mounting applications
Optical coupling between gallium arsenide infrared LED and photo transistor
Certified safety isolation meeting UL 1577 and VDE standards

Applications

Programmable controllers
High-density surface mounting circuits

Procurement Notes

Verify component status as the TLP181 series is documented as obsolete in available records. Confirm availability of replacement parts such as the TLP185. Ensure ordering suffixes match specific packaging or certification requirements. Validate RoHS compliance status against current manufacturing data sheets before procurement planning.

Selection Notes

Select this component for applications requiring small outline packages where space constraints prevent the use of larger DIP packages. Consider the 80V collector-emitter voltage rating for low-voltage switching tasks. Verify that the 50% minimum current transfer ratio meets the input drive requirements of the target circuit design.

Part Context

This part belongs to the Toshiba TLP181 series of mini flat couplers. The series is characterized by its reduced footprint compared to traditional dual in-line packages, facilitating automated surface mount technology processes. The specific model variant denotes the internal configuration and packaging type within this product line.