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Product Detailed Parameters
- Description：OPTOISO 3.75KV 1CH TRANS 6-SOP
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR)
- Number of Channels：1
- Voltage - Isolation：3750Vrms
- Current Transfer Ratio (Min)：100% @ 5mA
- Current Transfer Ratio (Max)：400% @ 5mA
- Turn On / Turn Off Time (Typ)：9µs, 9µs
- Rise / Fall Time (Typ)：5µs, 9µs
- Input Type：DC
- Output Type：Transistor
- Voltage - Output (Max)：80V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.25V
- Current - DC Forward (If) (Max)：50 mA
- Vce Saturation (Max)：300mV
- Operating Temperature：-55°C ~ 110°C
- Mounting Type：Surface Mount
- Package / Case：6-SOIC (0.173", 4.40mm Width), 4 Leads
- Supplier Device Package：6-SOP
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Overview
The TLP185(GB-TPL,E) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates an aluminum gallium arsenide infrared emitting diode with a phototransistor in a compact surface-mount package. The device provides electrical isolation with a rated insulation voltage of 3750 Vrms. Key electrical parameters include a collector-emitter voltage of 80V, a maximum forward current of 50mA, and a minimum current transfer ratio of 100%. It operates within a temperature range of -55°C to +110°C.
Feature Summary
- Provides high-voltage electrical isolation between input and output circuits using optical transmission.
- Features a high current transfer ratio for efficient signal coupling and drive capability.
- Designed for surface-mount installation in compact electronic assemblies.
Applications
- Input/output interface isolation in programmable logic controllers
- Signal transmission in AC/DC input modules
- Isolation in office equipment control circuits
Procurement Notes
Verify the specific suffix (TPL,E) against the manufacturer's official datasheet to confirm packaging type and compliance status. Confirm component lifecycle status as some variants may be marked as not recommended for new designs. Ensure sourcing channels provide valid traceability documentation for quality assurance purposes.
Selection Notes
Select this component when high isolation voltage and fast switching speeds are required in space-constrained designs. Consider the specific current transfer ratio grade required for the application logic levels. Verify that the surface-mount footprint matches the PCB layout constraints and thermal management requirements.
Part Context
This part belongs to the TLP185 series of small outline optocouplers designed for surface mounting. The series offers various current transfer ratio grades and packaging options to suit different industrial and consumer applications. It serves as a standard solution for galvanic isolation in digital communication and power control systems.
Replacement Considerations
Check for direct pin-compatible substitutes within the same family, such as other TLP185 variants with different suffixes. Verify that any replacement maintains the required 3750 Vrms isolation rating and operating temperature range before integration.
