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TLP2304(TPL,E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 3.75KV OPEN COLL S-O6. Review the specifications below when checking this part for your BOM.
The TLP2304(TPL,E is a high-speed photocoupler manufactured by Toshiba Semiconductor and Storage. It features an open-collector output configuration housed in a 5-pin SO6 package. The device provides electrical isolation with a rated insulation voltage of 3750Vrms. Key electrical parameters include a data rate of 1MBd, maximum propagation delays of 550ns for both low-to-high and high-to-low transitions, and a typical rise/fall time of 100ns. It operates within a supply voltage range of 4.5V to 30V and supports a continuous forward current of up to 8mA.
Verify the specific suffix (TPL) corresponds to the required tape-and-reel packaging format. Confirm RoHS compliance status matches project requirements. Ensure the supplier provides valid traceability documentation. Check that the component date code aligns with manufacturing availability constraints. Validate the package type against PCB footprint specifications before finalizing orders.
Select this component when high-speed isolation is required alongside an open-collector interface. Compare propagation delay specifications against system timing budgets. Evaluate the 3750Vrms isolation rating against safety standards applicable to the target application environment. Consider the operating temperature range and power dissipation limits during thermal analysis.
This part belongs to Toshiba's high-speed optocoupler family designed for robust signal integrity. It serves as a bridge between low-voltage digital circuits and higher-voltage isolated domains. The series emphasizes fast switching speeds and reliable isolation characteristics for demanding electronic environments.
Consult official Toshiba substitution guides for verified equivalents. Cross-reference pinouts and electrical characteristics carefully. Verify package compatibility and isolation ratings before implementing any alternative components.
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