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TLP521-1XSMT&R is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 4-SMD. Review the specifications below when checking this part for your BOM.
The TLP521-1XSMT&R is a single-channel optocoupler featuring an infrared LED input and NPN phototransistor output. It provides high isolation voltage of 5300Vrms and supports a maximum forward current of 50mA. The device offers a minimum current transfer ratio of 50% at 5mA input, with typical switching times of 3µs for both turn-on and turn-off. Designed for surface mount applications in a 4-pin SMD package, it ensures reliable signal transmission across isolated circuits while maintaining compact form factors suitable for dense PCB layouts.
Verify the specific suffix 'SMT&R' confirms surface mount tape-and-reel packaging configuration. Confirm the manufacturer designation matches Isocom Components 2004 LTD to ensure component authenticity. Check datasheet revisions for any updates to electrical characteristics or mechanical dimensions before finalizing procurement specifications.
Select this component when standard transistor output isolation is required with surface mount constraints. Ensure the 5300Vrms isolation rating meets circuit safety requirements. Verify that the 50mA collector current capacity aligns with load demands. Consider thermal management needs based on power dissipation limits in enclosed spaces.
This part belongs to the TLP521 series of high-density mounting phototransistor optically coupled isolators. The series is designed for general-purpose isolation applications where space efficiency and reliability are critical. Isocom Components manufactures these devices to meet global industry standards for optocouplers, providing alternatives to discontinued legacy parts.
Direct replacements include TLP521-1SM and TLP521-1XSM from the same manufacturer family. Cross-brand equivalents may exist but require verification of pin compatibility and electrical parameter alignment. Always confirm mechanical footprint and lead finish specifications match existing board designs.
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