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TLP521-4XGBSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV 4CH TRANS 16-SMD. Review the specifications below when checking this part for your BOM.
The TLP521-4XGBSM is a four-channel optocoupler manufactured by Isocom Components 2004 LTD. It features a surface mount DIP package with 16 pins. The device provides an isolation voltage of 5300Vrms and supports a maximum input current of 50 mA. It offers a high current transfer ratio of up to 100%. This component is designed for applications requiring robust electrical isolation between circuits.
Verify the manufacturer designation matches Isocom Components 2004 LTD exactly. Confirm the package type is surface mount DIP (SMD) with 16 pins. Ensure the channel count is four and the isolation voltage meets system requirements. Check for RoHS compliance if required by your design specifications.
Select this part when multiple isolated channels are needed in a compact surface mount form factor. Compare the 5300Vrms isolation rating against your circuit's safety standards. Consider the 100% current transfer ratio for efficient signal transmission. Verify pin compatibility with existing PCB footprints before finalizing the design.
This component belongs to the TLP521 series, which includes various configurations such as single, dual, and quad channel options. Isocom produces these as industry standard replacements. The XGB suffix typically denotes specific packaging or testing variations within the series.
Direct substitutes include other quad-channel optocouplers with similar DIP-16 packages and comparable isolation ratings. Verify pinout compatibility and electrical parameters like CTR and isolation voltage before substitution.
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