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TLP620-4XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV 4CH TRANS 16-SMD. Review the specifications below when checking this part for your BOM.
The TLP620-4XSM is a high-density quad optocoupler manufactured by Isocom Components 2004 LTD. It features four independent AC input to transistor output channels within a single surface-mount package. The device provides an isolation voltage of 5300 Vrms and supports a maximum forward current of 50 mA per channel. It operates within a temperature range of -30 °C to 100 °C and includes built-in diodes for AC compatibility.
Verify the specific suffix 'XSM' against official Isocom documentation to confirm the exact pinout, lead form, and tape-and-reel specifications. Ensure the selected variant matches the required PCB footprint and reflow soldering profile. Cross-reference approval numbers such as UL File No. E91231 and VDE standards for final compliance validation before integration.
Select this component when multiple isolated AC inputs are required in a space-constrained design. The quad architecture reduces board area compared to discrete single-channel units. Verify that the 50 mA forward current limit meets the drive requirements of the connected load. Ensure the operating temperature range aligns with the environmental conditions of the target application.
This part belongs to the TLP620 series of high-density AC input phototransistor optically coupled isolators. The series offers various lead forms and packaging options to suit different manufacturing needs. Isocom Components positions these devices as replacements for obsolete industry-standard optocouplers, providing enhanced parameter selection for specific circuit designs.
Publicly confirmed substitute part numbers include TLP620-4XGRSM, TLP621-4XGBSM, and ISP620-4X. Verify pin compatibility and electrical parameters before substitution. Note that ordering suffixes may indicate variations in packaging or lead finish without changing the core function.
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