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TLP621-2XGRSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-SMD. Review the specifications below when checking this part for your BOM.
The TLP621-2XGRSM is a surface-mount optocoupler manufactured by Isocom Components 2004 LTD. It features two independent channels within an 8-pin SMD package, designed for high-voltage isolation applications. The device utilizes a phototransistor output configuration and supports a maximum forward voltage of 1.3V with a peak input current rating of 50mA. Key electrical specifications include a minimum current transfer ratio of 100% and a typical rise time of 2μs alongside a typical fall time of 3μs. It provides robust insulation with an isolation voltage of 5300Vrms and operates reliably across a temperature range from -30°C to 100°C.
Verify the specific suffix designation against official manufacturer documentation to confirm exact pinout compatibility and tape-and-reel specifications. Ensure that the selected component meets all relevant safety certifications required for your target market. Cross-reference the datasheet parameters with your circuit design requirements to guarantee adequate margin for current transfer ratio and isolation voltage under operating conditions.
Select this component when dual-channel isolation is required in a surface-mount assembly. Consider the 5300Vrms isolation rating for high-noise environments. Evaluate the 100% minimum CTR to ensure sufficient drive capability for downstream logic or transistor stages. Confirm that the thermal operating range aligns with the environmental constraints of the final application enclosure.
This part belongs to the TLP621 series, which represents a family of high-speed optocouplers designed for general-purpose isolation tasks. The series offers various channel configurations and packaging options to suit different board space limitations. Isocom Components positions these devices as reliable alternatives for legacy components, maintaining standard pinouts while offering modern surface-mount convenience for automated assembly processes.
Check for parametric equivalents such as TLP621-2XGB for through-hole variants if layout changes are permitted. Verify that substitute parts maintain identical isolation voltage ratings and current transfer ratios to prevent circuit malfunction.
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