TLP700AF(TP,F)

Overview

The TLP700AF(TP,F) is a photocoupler manufactured by Toshiba Semiconductor and Storage, featuring a GaAlAs infrared light-emitting diode coupled with an integrated photodetector. It is housed in a 6-lead SDIP package, which is approximately 50% smaller than standard 8-pin DIP packages. The device provides electrical isolation with a voltage rating of 5000Vrms and contains one channel.

Feature Summary

• Compact 6-lead SDIP packaging for space-constrained designs
• High voltage isolation capability

Applications

• Gate driver circuits
• Industrial control systems
• Power supply feedback loops

Procurement Notes

Verify the specific suffix (TP,F) against official Toshiba documentation to confirm tape-and-reel packaging and lead-free status. Confirm current availability as some variants may be obsolete or discontinued. Ensure compatibility with existing PCB footprints for 6-SDIP gull-wing packages.

Selection Notes

Select this component when high isolation voltage is required in a compact form factor. The 6-lead SDIP package offers a size reduction compared to traditional 8-pin DIPs. Verify that the single-channel configuration meets the circuit requirements.

Part Context

This part belongs to the TLP700 series of optical couplers from Toshiba Semiconductor and Storage. The series utilizes GaAlAs LEDs for efficient light transmission. The TLP700AF variant specifically denotes the inclusion of an anti-parallel diode or specific internal configuration depending on the exact datasheet revision, housed in the miniaturized 6-lead SDIP format.

Replacement Considerations

Check for direct substitutes within the TLP700 family, such as TLP700AF(D4-TP,F), ensuring pinout and isolation ratings match. Verify if older versions like TLP700AF(S) are compatible replacements.