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TLP700A(S) is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is PHOTOCOUPLER. Review the specifications below when checking this part for your BOM.
The TLP700A(S) is a photocoupler manufactured by Toshiba Semiconductor and Storage, housed in a compact 6-lead SDIP package. It integrates a GaAlAs infrared light-emitting diode with an integrated high-gain, high-speed photodetector IC. This configuration provides electrical isolation between input and output circuits while enabling fast signal transmission. The device is designed for applications requiring reliable galvanic isolation, such as gate drive circuits for power semiconductors.
Verify the specific suffix (S) against the manufacturer's current datasheet to confirm pinout compatibility and packaging dimensions. Ensure the component meets the required isolation voltage ratings for the target application environment. Cross-reference the part number with official Toshiba Semiconductor documentation to validate authenticity and revision status before procurement.
Select this component when a compact form factor is critical for PCB layout constraints. The integrated high-speed photodetector makes it suitable for applications demanding rapid signal switching speeds. Consider the 6-lead SDIP package availability if through-hole mounting is preferred over surface-mount alternatives within the same product family.
The TLP700A belongs to Toshiba's line of high-speed photocouplers designed for industrial and consumer electronics. It serves as a smaller alternative to traditional 8-pin DIP optocouplers, offering similar functionality in a reduced footprint. The series supports various isolation applications where size and speed are prioritized alongside electrical safety standards.
Check for direct substitutes within the TLP700 series, such as the TLP700F, ensuring pin compatibility and identical functional specifications. Verify that any replacement maintains the same package type and isolation characteristics to avoid redesigning the host circuit board.
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