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TLP781F(D4-YH,F) is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLATOR 5KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The TLP781F(D4-YH,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a silicon phototransistor in a four-lead plastic DIP package featuring a 10.16mm pitch, designated as the F-type variant. The device provides high isolation voltage of 5000Vrms minimum between input and output circuits. Key electrical parameters include a collector-emitter breakdown voltage of 80V minimum, a forward current rating of 25mA maximum, and a dark current of 100nA maximum. The standard Current Transfer Ratio (CTR) is specified at 50% minimum, while the YH rank denotes a higher CTR specification of 100% minimum. Operating temperature range extends from -25°C to 85°C.
Verify the specific suffix configuration when ordering, as the D4-YH designation indicates a particular Current Transfer Ratio rank that differs from standard variants. Confirm the DIP4-F package style corresponds to the required 10.16mm lead pitch for your PCB layout. Ensure compliance with RoHS directives if environmental regulations apply to your manufacturing process. Cross-reference the datasheet for the exact CTR limits associated with the YH ranking to guarantee circuit performance margins.
Select this component when a wide lead pitch is necessary for surface mount assembly or rework purposes, distinguishing it from the standard 7.62mm pitch TLP781. The YH rank offers a higher minimum current transfer ratio compared to the base model, providing greater gain margin for switching applications. Consider the 80V collector-emitter voltage limit when designing output stages. This device is suitable for general isolation tasks where moderate speed and high voltage isolation are prioritized over high-speed digital signaling requirements.
This part belongs to the TLP781 series of photocouplers, which utilize a GaAs IRED and silicon phototransistor architecture. The TLP781F variant specifically refers to the version with expanded lead spacing (10.16mm) compared to the standard TLP781 (7.62mm). The series is widely recognized for its reliability in industrial and consumer electronics, offering a balance of performance and cost-effectiveness for basic isolation needs.
Direct substitutes within the same family include the TLP781(D4-GB-LF7) for standard pitch applications with different CTR ranks. For identical pitch but different CTR specifications, consider other suffixes within the TLP781 lineup. Generic replacements must match the 5000Vrms isolation rating, 80V Vceo, and DIP4 form factor.
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