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TLV9162IDDFR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is DUAL, 16-V, 10-MHZ, RAIL-TO-RAIL. Review the specifications below when checking this part for your BOM.
The TLV9162IDDFR is a dual-channel, general-purpose operational amplifier from Texas Instruments. It features rail-to-rail input and output capabilities with a supply voltage range of 2.7 V to 16 V. Key electrical specifications include an 11 MHz gain-bandwidth product, a 33 V/µs slew rate, and a typical input offset voltage of ±210 µV. The device operates with a quiescent current of 2.4 mA per amplifier and supports an operating temperature range from -40°C to +125°C.
Verify the specific package variant matches the design requirements, as the TLV9162 family includes multiple options such as SOIC, TSSOP, and WSON. Confirm that the ordering suffix corresponds to the desired tape-and-reel configuration for automated assembly processes. Ensure compatibility with the target PCB footprint and thermal management strategy before finalizing procurement.
Select this component when high precision and wide bandwidth are required within a single-supply or split-supply architecture. The low offset voltage and drift make it suitable for sensor interfaces where DC accuracy is critical. Consider the SOT-23-8 package for space-constrained designs while ensuring adequate thermal dissipation for the specified load conditions.
This device belongs to the TLV916x family, which also includes single-channel (TLV9161) and quad-channel (TLV9164) variants. All members share similar electrical characteristics, including the 16V rating and 11MHz bandwidth. The IDDFR suffix specifically denotes the dual-channel version housed in an 8-pin SOT-23 thin package, optimized for compact surface-mount applications.
Direct pin-compatible substitutes within the same family include TLV9161 and TLV9164, though channel counts differ. Other general-purpose op amps may require schematic adjustments due to differences in offset voltage, bandwidth, or package dimensions. Verify electrical parameters against the original design constraints before substitution.
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