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Product Detailed Parameters
- Description：OPTOISO 3.75KV OPEN COLL S-O6
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR),Cut Tape (CT)
- Number of Channels：1
- Inputs - Side 1/Side 2：1/0
- Voltage - Isolation：3750Vrms
- Common Mode Transient Immunity (Min)：15kV/µs
- Input Type：DC
- Output Type：Open Collector
- Current - Output / Channel：15 mA
- Data Rate：-
- Propagation Delay tpLH / tpHL (Max)：400ns, 550ns
- Rise / Fall Time (Typ)：-
- Voltage - Forward (Vf) (Typ)：1.56V
- Current - DC Forward (If) (Max)：25mA
- Voltage - Supply：4.5V ~ 20V
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Surface Mount
- Package / Case：6-SOIC (0.179", 4.55mm Width), 5 Leads
- Supplier Device Package：6-SO, 5 Lead
- Grade：Automotive
- Qualification：AEC-Q101
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Overview
The TLX9304(TPL,F is a single-channel logic output optocoupler manufactured by Toshiba Semiconductor and Storage. Designed for automotive applications, it meets AEC-Q101 qualification standards. The device features an open collector output and utilizes a SOIC-6 surface-mount package. Key electrical specifications include a maximum propagation delay of 550 ns, an insulation voltage of 3750 Vrms, and a continuous output current rating of 15 mA. It operates within a temperature range of -40°C to +125°C, with a power dissipation capacity of 50 mW.
Feature Summary
- AEC-Q101 qualified for automotive reliability requirements
- High insulation voltage capability of 3750 Vrms
- Open collector logic output configuration
- Compact SOIC-6 surface-mount packaging
Applications
- Inverter control in automotive systems
- Automotive electronic circuit isolation
- Signal transmission between isolated circuits
Procurement Notes
Verify the complete part number including suffixes such as (TPL,F) to ensure correct packaging and compliance status. Confirm AEC-Q101 certification requirements against specific project needs. Check datasheet for thermal management guidelines given the 50 mW power dissipation limit. Ensure input current does not exceed specified maximums during operation.
Selection Notes
Select this component when high-voltage isolation is required in space-constrained automotive designs. The SOIC-6 package suits automated surface-mount assembly processes. Consider the 550 ns propagation delay for timing-sensitive applications. Verify that the open collector output interface matches the receiving circuit's logic requirements.
Part Context
This device belongs to Toshiba's automotive photocoupler family, specifically designed for solid-state relay and isolator applications. It integrates an infrared emitting diode with a photointegrator on a single chip. The product line emphasizes reliability and compact form factors for modern vehicle electronics.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult Toshiba technical support or official distributor catalogs for verified cross-reference options before implementation.
