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TM8050H-8W is listed in the Scrs range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is SCR 800V 80A TO247. Review the specifications below when checking this part for your BOM.
The STMicroelectronics TM8050H-8W is an 80 A high-temperature SCR thyristor housed in a through-hole TO-247 package. It features a blocking voltage of 800 V and supports a nominal RMS current of 80 A with a maximum junction temperature of +150 °C. The device offers low gate triggering current (I_GT max 50 mA) and high noise immunity with dV/dt exceeding 1 kV/µs. It includes ECOPACK2 compliance for halogen-free and RoHS standards, providing enhanced thermal margins and low leakage currents in the blocking state.
Verify the specific suffix 'W' corresponds to the TO-247 through-hole package variant when sourcing. Confirm that the 800 V rating aligns with system voltage requirements. Ensure the design accounts for the 80 A RMS current capacity under appropriate thermal management conditions. Check for ECOPACK2 compliance documentation if environmental regulations are strict. Validate gate trigger parameters against the driving circuit capabilities.
Select this component for applications requiring robust high-temperature operation up to 150 °C. It is suitable where low power dissipation and high power switching are critical. Consider the TO-247 package for through-hole assembly needs. The low gate current simplifies control circuitry design. Ensure the application benefits from the high dV/dt immunity for noisy environments.
This part belongs to STMicroelectronics' high-temperature thyristor series designed for demanding industrial and automotive power switching tasks. It complements other variants like the TM8050H-8D3, which offers a surface-mount D3PAK option for compact designs while maintaining similar electrical characteristics and high-temperature performance ratings.
Direct substitutes within the same family include the TM8050H-8D3 for surface-mount implementations. Verify pinout compatibility and thermal resistance differences when replacing through-hole parts with surface-mount equivalents or vice versa.
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