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— IC芯片 | 连接器 | 传感器 | 被动器件 —
TMMDB3TG is listed in the DIACs, SIDACs range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is DIAC 30-34V 2A MINIMELF. Review the specifications below when checking this part for your BOM.
The TMMDB3TG is a bidirectional trigger diode (Diac) manufactured by STMicroelectronics, designed for simplified gate control circuits and fluorescent lamp ballasts. It operates in the Mini MELF surface-mount package with a breakover voltage range of 30 V to 34 V and a nominal turn-on voltage of 32 V. The device supports a maximum breakover current of 15 µA and functions within an operating temperature range of -40 °C to +125 °C. Key electrical specifications include a repetitive peak off-state voltage capability suitable for standard AC line applications and low triggering current requirements for efficient triac interface.
Verify component authenticity through authorized STMicroelectronics distributors or certified partners. Confirm the presence of official marking codes and datasheet revision alignment. Request batch traceability documentation to ensure compliance with specified temperature ranges and electrical tolerances. Validate packaging integrity against moisture sensitivity levels prior to assembly.
Select this component when a stable breakover voltage near 32 V is required for triggering thyristors or triacs. Ensure the application environment remains within the -40 °C to +125 °C operational limits. Consider the Mini MELF package constraints for PCB layout and thermal management. Verify that the low breakover current specification meets the drive capabilities of the target control circuitry.
This Diac belongs to the TMMDB series of trigger devices from STMicroelectronics. It serves as a fundamental switching element in AC power control systems. The device complements other thyristor family components by providing precise voltage threshold detection for symmetrical conduction initiation.
Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing with generic DIAC equivalents requires independent verification of electrical parameters and package dimensions.
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