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TMS320C6748EZCE4 is listed in the Digital Signal Processor Dsp range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DSP FIX/FLOAT POINT 361NFBGA. Review the specifications below when checking this part for your BOM.
The TMS320C6748EZCE4 is a fixed- and floating-point digital signal processor from Texas Instruments, based on the C674x VLIW DSP core. It operates at clock frequencies up to 456 MHz (at 1.3V core voltage) or 375 MHz (at 1.2V). The device delivers up to 3648 MIPS and 2746 MFLOPS. It features a two-level cache architecture comprising 32KB L1P, 32KB L1D, and 256KB L2 unified RAM/cache, alongside an additional 128KB shared RAM. The EZCE4 suffix denotes the commercial temperature range (-40°C to +85°C) and the 361-ball NFBGA package with a 0.65mm ball pitch.
Verify the ordering suffix 'EZCE4' corresponds to the specific package dimensions (13mm x 13mm) and commercial temperature range required for the design. Confirm that the 0.65mm ball pitch NFBGA footprint matches the PCB layout. Ensure power supply rails are capable of delivering the necessary current for the 1.3V core and 1.8V/3.3V I/O domains during peak operation.
Select this component when both high-performance floating-point math and extensive connectivity peripherals are needed in a low-power form factor. The 456 MHz variant requires a 1.3V core voltage, while the 375 MHz variant uses 1.2V. Consider the 256KB L2 cache configurability and the availability of the 128KB shared RAM for non-DSP system masters when planning memory allocation.
This part belongs to the TMS320C6748 family, which integrates a C674x DSP core with an ARM926EJ-S core in some variants, though the base C6748 datasheet focuses on the DSP subsystem. The ZCE package variant is distinct from the ZWT (16mm x 16mm, 0.80mm pitch) package. It is designed as a low-power applications processor within the broader TMS320C6000 platform.
The TMS320C6748ZWT4 is a pin-compatible alternative using the larger 16mm x 16mm NFBGA package with 0.80mm pitch. Verify thermal requirements and PCB space constraints when substituting between the ZCE and ZWT packages.
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