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TNETD4200GLS240 is listed in the Telecom range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is 320C6201 352PIN BGA REV3.1 FOR A. Review the specifications below when checking this part for your BOM.
The TNETD4200GLS240 is a digital signal processor component manufactured by Texas Instruments, housed in a flip-chip Ball Grid Array (BGA-FC) package designated with the GLS code. The physical dimensions of this package are 18x18mm, and it utilizes a 384-pin configuration. The device operates at a specified frequency of 240MHz, as indicated by the model suffix. It is designed for high-performance digital processing applications requiring robust packaging solutions.
Verify the specific manufacturing lot date against PCN# 20010118000 when sourcing this component. Products shipped after September 2001 may utilize a 4-metal layer substrate without solder injection and Dexter Hysol FP4549 underfill material instead of the original 8-metal layer and Namics 8437-2 materials. Confirm that the received unit matches the required substrate specification for your application's reliability standards.
Select the TNETD4200GLS240 variant specifically for designs requiring a 240MHz operating frequency within the TNETD4200 family. Ensure the PCB layout accommodates the 18x18mm footprint and the 384-pin ball grid array configuration. Consider the moisture sensitivity level 4 rating during storage and handling procedures to prevent package damage before reflow soldering.
This component belongs to the TNETD4200 series of digital signal processors from Texas Instruments. It shares the same GLS package type and core architecture with variants such as the TNETD4200GLS200 and TNETD4200CGLS. The primary distinction lies in the operational frequency, which defines the specific performance tier within this product line.
Direct functional replacements include other members of the TNETD4200 series, such as the TNETD4200GLS200 or TNETD4200GLSA240, provided the frequency requirements align. Verify pin compatibility and thermal characteristics before substituting.
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