TPA0102PWPRG4

Overview

The TPA0102PWPRG4 is a stereo audio power amplifier in a 24-pin PowerPAD (PWP) package. It delivers 1.5 W per channel into 4-ohm loads at 5 V and 600 mW per channel at 3.3 V. The device supports Bridge-Tied Load (BTL) and Single-Ended (SE) modes with an internal input MUX for switching between headphone and line inputs. Operating supply voltage ranges from 3 V to 5.5 V, with an operating temperature range of -40°C to 85°C.

Feature Summary

• Integrated stereo input multiplexer allows automatic switching between headphone and line inputs based on the HP/LINE control pin state.
• Configurable output topology supports both Bridge-Tied Load (BTL) and Single-Ended (SE) modes via the SE/BTL control pin.
• Thermally enhanced PowerPAD package provides high power dissipation capability comparable to larger through-hole packages while maintaining a low-profile surface-mount form factor.

Applications

• Notebook computer internal speaker drive systems
• Portable multimedia devices requiring integrated headphone and line outputs
• Small non-powered external speakers for portable systems

Procurement Notes

Verify component authenticity against Texas Instruments manufacturing records. Confirm the PWP package marking matches the datasheet specifications. Ensure the ordering suffix RG4 corresponds to the required lead-free and RoHS compliance status for your specific procurement requirements.

Selection Notes

Select this component when a single-chip solution is needed to replace multiple mono amplifiers for stereo applications. It is suitable for designs requiring low-voltage operation down to 3.3 V and features that minimize board space by integrating input switching and thermal management capabilities.

Part Context

This part belongs to the TPA0102 family of linear audio power amplifiers. It serves as an upgrade path from older mono amplifier series like the TPA4860/61, consolidating functionality for stereo speaker and headphone drive into one device. The PowerPAD variant specifically addresses thermal constraints in dense PCB layouts.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.