ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC AMP CLASS D STER 1.4W 25DSBGA
- Series：DirectPath™
- Mfr：Texas Instruments
- Package：Tape & Reel (TR),Cut Tape (CT),Bulk
- Type：Class D
- Output Type：2-Channel (Stereo) with Stereo Headphones
- Max Output Power x Channels @ Load：1.4W x 2 @ 8Ohm
- Voltage - Supply：2.5V ~ 5.5V
- Features：Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control
- Mounting Type：Surface Mount
- Supplier Device Package：25-DSBGA
- Package / Case：25-UFBGA, DSBGA
- Operating Temperature：-40°C ~ 85°C (TA)
- Grade：-
- Qualification：-
Download product information
Overview
The TPA2050D4YZKR is a stereo Class-D audio amplifier with an integrated DirectPath headphone amplifier and a 2:1 multiplexer. It delivers 1.4 W into an 8 Ω load at 5.0 V with 10% THD+N. The device operates from a supply voltage range of 2.5 V to 5.5 V. It includes a 145-mW headphone amplifier channel. The component is housed in a 25-pin DSBGA (YZK) package and supports an operating temperature range of -40°C to 85°C.
Feature Summary
- Integrates a stereo Class-D power amplifier with a dedicated stereo DirectPath headphone output
- Includes a 2:1 analog input multiplexer for flexible source selection
- Features built-in protection mechanisms including short-circuit, thermal shutdown, and pop-and-click suppression
Applications
- Portable multimedia devices requiring high-efficiency audio amplification
- Handheld gaming consoles and portable media players
- Smart home audio assistants and IoT speakers
Procurement Notes
Verify the complete part number including the YZKR suffix to ensure correct packaging and tape-and-reel configuration. Confirm the manufacturing date code and lot traceability requirements against your specific quality standards. Ensure compatibility with the intended PCB footprint for the 25-DSBGA package during procurement planning.
Selection Notes
Select this component when a compact solution combining main speaker amplification and headphone driving is required. The integrated MUX simplifies board design by reducing external switching components. Consider the 2.5 V to 5.5 V supply range suitability for battery-powered applications where efficiency and low quiescent current are critical design constraints.
Part Context
This device belongs to Texas Instruments' TPA2050 family of audio amplifiers. It is designed for space-constrained mobile applications. The integration of Class-D technology allows for high output power with minimal heat dissipation compared to linear amplifiers.
Replacement Considerations
Check for direct pin-to-pin replacements within the TPA2050 series or compatible TI audio amplifier families. Verify that alternative parts support the same 25-DSBGA package and include similar integrated features such as the headphone amp and MUX functionality.
