TPA311D

Overview

The TPA311D is a Class-AB mono audio power amplifier designed for low-voltage applications. It operates within a supply voltage range of 2.5 V to 5.5 V and delivers up to 350 mW into an 8 Ω load in bridge-tied load (BTL) mode at 5 V. The device supports single-ended (SE) operation, features integrated depop circuitry, shutdown control with microampere standby current, and includes thermal and short-circuit protection.

Feature Summary

• Configurable between bridge-tied load and single-ended modes via a dedicated control pin
• Integrated depop circuitry eliminates speaker noise during startup and shutdown transitions
• Shutdown mode significantly reduces supply current for battery-powered applications
• Built-in thermal overload and short-circuit protection ensures operational reliability

Applications

• Internal speakers in portable handheld equipment
• External earphone drive circuits
• Cellular communication devices
• Low-voltage consumer audio systems

Procurement Notes

Verify the specific package variant, as the TPA311D designation corresponds to the SOIC-8 surface-mount package. Confirm that the ordering suffix matches the required tape-and-reel or tube configuration if applicable. Ensure the component meets the specified RoHS compliance standards for the target manufacturing process.

Selection Notes

Select this amplifier for designs requiring minimal external components due to its integrated biasing and protection features. The BTL configuration is optimal for maximizing output power without large coupling capacitors. Consider the SE mode when driving high-impedance loads like earphones where differential drive is unnecessary.

Part Context

This component belongs to the TPA311 series of audio amplifiers from Texas Instruments. It is characterized for operation across a wide temperature range of -40°C to +85°C. The device is optimized for voice band frequencies and narrow-band applications typical in mobile telecommunications hardware.

Replacement Considerations

The TPA311DG4 is a lead-free version of the same functional device. Verify pinout compatibility and thermal characteristics when substituting packages such as the PowerPAD MSOP variant.