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Product Detailed Parameters
- Description：IC AMP CLASS AB MONO 700MW 8MSOP
- Series：-
- Mfr：Texas Instruments
- Package：Tape & Reel (TR),Bulk
- Type：Class AB
- Output Type：1-Channel (Mono)
- Max Output Power x Channels @ Load：700mW x 1 @ 8Ohm
- Voltage - Supply：2.5V ~ 5.5V
- Features：Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
- Mounting Type：Surface Mount
- Supplier Device Package：8-HVSSOP
- Package / Case：8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Operating Temperature：-40°C ~ 85°C (TA)
- Grade：-
- Qualification：-
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Overview
The TPA751DGNRG4 is a Texas Instruments mono Class-AB audio power amplifier in an 8-pin PowerPAD MSOP package. It operates on a single supply voltage ranging from 2.5 V to 5.5 V. The device delivers 700 mW of output power into an 8 Ω load at 5 V, with a typical supply current of 1.45 mA. Key electrical parameters include a unity-gain bandwidth of 1.4 MHz and a shutdown supply current as low as 1.5 nA.
Feature Summary
- Bridge-tied load (BTL) configuration eliminates the need for external output coupling capacitors.
- Integrated thermal protection and short-circuit protection mechanisms ensure operational safety.
- Shutdown mode provides ultralow supply current consumption for battery-powered applications.
Applications
- Low-voltage portable electronic devices requiring internal speakers
- Wireless communication equipment optimized for narrower band applications
- Battery-powered handheld systems prioritizing power efficiency
Procurement Notes
Verify that the ordering suffix 'R' confirms the taped and reeled packaging format required for automated assembly processes. Confirm the 'G4' suffix indicates compliance with specific environmental standards. Ensure the component matches the PowerPAD MSOP physical dimensions for PCB footprint compatibility.
Selection Notes
Select this component when a bridge-tied load topology is required to maximize output power without using bulky coupling capacitors. It is suitable for designs operating between 2.5 V and 5.5 V where thermal management via the exposed pad is necessary. Consider the 1.4 MHz bandwidth for voice-band or narrowband audio signals.
Part Context
This part belongs to the TPA751 family of low-voltage audio amplifiers. Other variants include the SOIC package (TPA751D) and the MicroStar Junior BGA package (TPA751GQS). The DGN package offers higher thermal dissipation capabilities compared to standard SOIC packages, supporting continuous RMS power delivery.
Replacement Considerations
TPA751DGN is the identical component in tube packaging. TPA751DR is the SOIC package variant in tape and reel format. TPA751GQSR is the MicroStar Junior BGA variant in tape and reel format.
