SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TPM2003-TS3R is a BJT transistor array manufactured by 3PEAK, designed for surface-mount applications. It features a dual NPN configuration housed in a compact 16-pin TSSOP package. This component serves as a discrete switching element within electronic circuits, providing reliable current handling capabilities through its integrated transistor structure.
Verify the specific datasheet for electrical characteristics and thermal limits before integration. Confirm that the 16-TSSOP footprint matches the target PCB layout. Ensure supply chain sources provide authentic components from 3PEAK to guarantee performance reliability.
Select this part when a dual NPN array is required in a low-profile surface-mount form factor. The TSSOP-16 package offers a balance between pin count and board space efficiency. Consider thermal dissipation requirements relative to the expected load currents in the final application.
This component belongs to the 3PEAK portfolio of analog and mixed-signal semiconductor solutions. The company specializes in high-performance chips for automotive, industrial, and communication sectors. The TPM2003 series represents their discrete transistor offerings for standard switching tasks.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative BJT arrays based on pinout, voltage ratings, and package dimensions.