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TPS2321IDR is listed in the Hot Swap Controllers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC HOT SWAP CTRLR GP 16SOIC. Review the specifications below when checking this part for your BOM.
The TPS2321IDR is a dual hot swap power controller manufactured by Texas Instruments, designed for safe insertion and removal of live circuit boards. It operates within a supply voltage range of 3 V to 13 V and features two independent channels with integrated circuit breaker functionality. The device supports a maximum operating temperature of +85°C and draws a typical quiescent current of 200 µA. Packaged in a 16-pin SOIC (Narrow) surface-mount case, it provides robust protection against overcurrent and thermal events during system maintenance.
Verify the specific suffix 'IDR' indicates tape-and-reel packaging versus the 'ID' tube variant. Confirm RoHS compliance status through official datasheets. Ensure the 16-SOIC package dimensions match your PCB footprint requirements. Check for any recent lifecycle notices regarding obsolescence or alternative recommendations from Texas Instruments.
Select this component when dual independent hot swap protection is required within a 3V to 13V input range. Consider the 200 µA quiescent current for low-power standby applications. The SOIC-16 package suits space-constrained designs needing surface-mount assembly. Verify thermal performance meets your board's heat dissipation capabilities under full load conditions.
This part belongs to the TPS2321 family of dual hot swap controllers. It complements other Texas Instruments power management solutions by providing precise current limiting and soft-start features. The device is distinct from RS-232 interface ICs like the MAX232ID, serving purely as a power distribution protector rather than a communication transceiver.
Consult Texas Instruments documentation for direct pin-compatible alternatives. Verify that substitute parts maintain identical dual-channel functionality and 13V maximum rating. Ensure replacement components support the same SOIC-16 package and thermal characteristics.
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