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TPS2359RHHR is listed in the Hot Swap Controllers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC HOT SWAP CTRLR ATCA 36VQFN. Review the specifications below when checking this part for your BOM.
The TPS2359RHHR is a full-featured, dual-slot AdvancedMC controller manufactured by Texas Instruments. It operates within a supply voltage range of 3V to 4V and 8.5V to 15V. The device supports four channels and features an internal current output capability of up to 165mA. Designed for surface mount installation, it utilizes a 36-VFQFN package with an exposed pad, specifically the 36-VQFN (6x6) configuration. The component is rated for operation across a temperature range of -40°C to 85°C.
Verify the specific suffix 'HHR' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging specifications and moisture sensitivity level (MSL 3). Ensure that the ordering information aligns with the standard delivery period of nine weeks. Cross-reference the RoHS status to confirm compliance with RoHS3 standards before finalizing procurement orders.
Select this component when designing for ATCA or MicroTCA environments requiring dual-slot AdvancedMC support. Consider its 36-VQFN footprint and 3V–15V supply requirements during PCB layout. Evaluate the need for programmable fault protection and I2C monitoring against system complexity constraints. Verify thermal management capabilities given the exposed pad design and operating temperature range.
The TPS2359 series serves as a comprehensive power management solution for advanced computing architectures. It integrates multiple control functions into a single IC, reducing bill-of-materials count. The RHHT variant shares identical electrical characteristics but differs in packaging format. This family addresses the stringent reliability and feature requirements of telecommunications infrastructure applications.
The TPS2359RHHT is a confirmed substitute part number with identical functional specifications. Verify that the packaging difference does not impact the assembly process. No other direct substitutes are documented in the provided public data.
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