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TS50P07GHC2G is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is BRIDGE RECT 1PHASE 1KV 50A TS-6P. Review the specifications below when checking this part for your BOM.
The TS50P07GHC2G is a single-phase bridge rectifier manufactured by Taiwan Semiconductor. It utilizes standard silicon technology and features a TS-6P through-hole package with four terminals. The device supports a maximum repetitive peak reverse voltage of 1000V and provides an average rectified output current of 50A. Key electrical characteristics include a forward voltage of 1.3V at the rated current and a reverse leakage current of 20µA at full blocking voltage. It operates within a junction temperature range of -55°C to 150°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pinout orientation and terminal plating specifications. Ensure the component meets the required UL recognition standards for the target application. Cross-reference the exact part number with authorized distributors to confirm availability and authenticity before procurement.
Select this component when a high-current single-phase rectification solution is required in a through-hole configuration. Compare the 50A current rating and 1000V blocking voltage against circuit requirements. Evaluate the thermal performance and package dimensions to ensure compatibility with the printed circuit board layout and heat dissipation strategy.
This component belongs to the TS series of bridge rectifiers from Taiwan Semiconductor, designed for general-purpose power applications. The series offers various current ratings and voltage options within standardized packages. The TS-6P form factor allows for efficient PCB mounting while maintaining robust electrical connections for high-current handling.
Direct replacements must match the 50A current rating, 1000V voltage rating, and TS-6P package type. Verify that alternative parts maintain identical pin configurations and thermal characteristics to ensure seamless integration without redesigning the host circuit.
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