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TSF40L200C is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARR SCHOTTKY 200V ITO220AB. Review the specifications below when checking this part for your BOM.
The TSF40L200C is a silicon Schottky rectifier diode manufactured by Taiwan Semiconductor Corporation. It features a single-phase, two-element common cathode configuration housed in an isolated TO-220AB package with three terminals. The device is rated for a maximum average forward rectified current of 20A and a repetitive peak reverse voltage of 200V. It operates within a junction temperature range of -55°C to +150°C and supports a non-repetitive peak forward surge current of 200A.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pinout orientation and thermal pad specifications. Ensure the component meets RoHS compliance requirements if mandated by the target assembly standards. Cross-reference the package outline dimensions with the JEDEC TO-220AB standard to guarantee mechanical fit within the designated enclosure.
Select this component when a 200V blocking capability is required alongside high-efficiency switching characteristics. The common cathode arrangement simplifies circuit layout compared to discrete single-diode solutions. Verify that the thermal management system can handle the dissipation at the intended 20A load current while maintaining junction temperatures below the 150°C maximum limit.
This part belongs to the TSF series of ultra-fast recovery and Schottky rectifiers from Taiwan Semiconductor. The series is engineered for high-frequency power conversion applications where minimizing reverse recovery charge and forward conduction losses is critical. The TO-220AB form factor provides a balance between current handling capacity and ease of manual or automated assembly.
Consult official substitution guides for equivalent 20A, 200V Schottky diodes in TO-220AB packages. Verify that any alternative maintains identical pin configurations and thermal resistance values to ensure compatibility with existing board layouts and cooling systems.
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